SANTA CLARA, Calif .– (COMMERCIAL THREAD) –What’s up: In its relentless pursuit of Moore’s Law, Intel is unveiling key breakthroughs in packaging, transistor and quantum physics fundamental to advancing and accelerating computing over the next decade. At the IEEE International Electron Devices Meeting (IEDM) 2021, Intel paved the way for a more than 10 times improvement in interconnect density in hybrid link packaging, a 30% to 50% improvement in scaling of transistors, major advances in new power and memory technologies, and new physics concepts that could one day revolutionize computing.
“At Intel, the research and innovation needed to advance Moore’s Law never stops. Our Components Research Group shares key research advancements at MEI 2021 by bringing ground-breaking process and packaging technologies to meet the insatiable demand for powerful computing upon which our industry and our society depend. It is the result of the tireless work of our best scientists and engineers. They continue to be at the forefront of innovations to continue Moore’s Law.
âRobert Chau, Intel Senior Fellow and General Manager of Component Research
Why is this important: Moore’s Law followed computer innovations that meet the demands of every generation of technology, from mainframes to mobile phones. This evolution continues today as we enter a new era of computing with unlimited data and artificial intelligence.
Continuous innovation is the cornerstone of Moore’s Law. Intel’s Components Research Group is committed to innovating in three key areas: scaling technologies essential to deliver more transistors; new silicon capabilities for power and memory gains; and the exploration of new concepts in physics to revolutionize the way the world does computing. Most of the innovations that broke through previous Moore’s Law barriers and are found in products today began with the work of Component Research – including strained silicon, Hi-K metal grids, FinFET transistors, RibbonFET and packaging innovations including EMIB and Foveros Direct.
How we do it: The breakthroughs revealed at the MEI 2021 demonstrate that Intel is on track to continue the advancements and benefits of Moore’s Law well beyond 2025 through its three focus areas.
1. Intel is continuing significant research into scaling technologies essential to deliver more transistors in future product offerings:
Company researchers described solutions for the design, process, and assembly challenges of the hybrid link interconnect, envisioning a more than 10-fold improvement in interconnect density in the package. At the Intel Accelerated event in July, Intel announced plans to introduce Foveros Direct, allowing bumps smaller than 10 microns, offering an order of magnitude increase in interconnect density for 3D stacking. To enable the ecosystem to reap the benefits of advanced packaging, Intel is also calling for the establishment of new industry standards and testing procedures to enable a hybrid bonding chip ecosystem.
Beyond its full RibbonFET, Intel is mastering the coming post-FinFET era with a Multiple Transistor Stacking (CMOS) approach that aims to achieve a maximized 30% to 50% logical scaling improvement. for the continued advancement of Moore’s Law by installing more transistors per square millimeter.
Intel is also leading the way in advancing Moore’s Law in the Angstrom era with forward-looking research showing how new materials just a few atoms thick can be used to fabricate transistors that exceed the limits of conventional silicon channels, allowing millions of additional transistors per chip area. for ever more powerful computing over the next decade.
2. Intel brings new capabilities to silicon:
More efficient power technologies are advancing with the world’s first integration of GaN-based power switches with silicon-based CMOS on a 300mm wafer. This paves the way for low-loss, high-speed power supply to processors while simultaneously reducing components and motherboard space.
Another advancement is Intel’s industry-leading low-latency read / write capabilities using novel ferroelectric materials for a possible next-generation integrated DRAM technology that can provide greater memory resources to meet the demands of the customer. to the increasing complexity of computing applications, from games to AI.
3. Intel is looking for massive performance with quantum computing based on silicon transistors, as well as entirely new switches for energy-efficient computing with new devices at room temperature. In the future, these revelations could replace conventional MOSFETs using entirely new concepts in physics:
At the MEI 2021, Intel presented the world’s first experimental realization of a spin-orbiting magnetoelectric logic device (MESO) at room temperature, which showed the possibility of manufacturing a new type of transistor based on switching. nanoscale magnets.
Intel and IMEC are advancing in spintronic material research to bring device integration research closer to achieving a fully functional torque device.
Intel also showcased complete 300mm qubit process flows for achieving scalable quantum computing compatible with CMOS manufacturing and identifies next steps for future research.
About component research: Components Research, the research group of Intel Technology Development, is charged with providing revolutionary packaging technology and process options that extend Moore’s Law and enable Intel products and services. It keeps Intel’s research and development pipeline full by working with the company’s business units to anticipate future needs and by collaborating with external groups – from U.S. government research labs and industry consortia to research groups. academics and providers.
More context: 3D stacked transistors: improving the area by building up (video) | Foveros Direct: advanced packaging technology to continue Moore’s Law (video) | Intel’s Components Research Group Invents Revolutionary Process and Packaging Technology (Video)
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continually work to advance semiconductor design and manufacture to help meet our customers’ greatest challenges. By integrating intelligence across the cloud, network, edge, and any kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel’s innovations, visit newsroom.intel.com and intel.com.
All product and service plans and roadmaps are subject to change without notice. All forecasts of goods and services necessary for Intel’s operations are provided for discussion purposes only. Intel will have no responsibility to make a purchase in relation to the forecasts published in this document. Code names are often used by Intel to identify products, technologies, or services that are in development and whose usage may change over time. No license (express or implied, estoppel or otherwise) of intellectual property rights is granted by this document. Product and process performance will vary based on usage, configuration, and other factors. Learn more at www.Intel.com/PerformanceIndex and www.Intel.com/ProcessInnovation.
References to research results, including comparisons to technologies, products, processes or packaging performance, are estimates and do not imply availability. Release dates and / or referenced capacities may vary based on usage, configuration and other factors. The products and services described may contain defects or errors which may lead to deviations from the published specifications. Current characterized errata are available on request. Intel disclaims all express and implied warranties, including, but not limited to, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranties arising out of the course of performance, the course for business or use in commerce.
Statements contained in this document which refer to future plans or expectations are forward-looking statements. These statements are based on current expectations and involve numerous risks and uncertainties which could cause actual results to differ materially from those expressed or implied in these statements. For more information on factors that could cause actual results to differ materially, see our most recent earnings publication and SEC filings at www.intc.com.
Â© Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.